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      RH150

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      产品描述

      RH150

       

      (UL ANSI:FR-4.1)High Performance,Mid-Tg Halogen-free

       

      特点            

      1. 不含卤素、砷、红磷等成份
      2. 优良的机械加工性能和热性能,适用于无铅工艺

      应用领域            
      手机、便携式电子产品、笔记本电脑、检测设备、通信、网络设备

       

       FEATURES     

      1. Free of constituents such as halogen,animony,red phosphorous,ect。
      2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

       APPLICATIONS     
      Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

       

      GENERAL PROPERTIES    

      Test Item

      Test condition

      Units

      Standard value

      Typical value

      1.Peel Strength , IBS/IN,Minimum,1 OZ

       

      IBS/IN

       

       

      As received

      A

      ≥8.0

      10.8

      After thermal stress

      A

      ≥8.0

      10.8

      2. Volume resistivity ,Minimum
      At elevated temperature E-24/125

      E-24/125

      MΩ.cm  

      ≥103

      ≥107

      3. Surface resistivity , Minimum                              
      At elevated temperature E-24/125        

       E-24/125

      ≥103

      ≥107

      4.Water absorption , Maximum

      E-1/105+des

      %

      ≤0.50

      0.15

      5.Dielectric Breakdown, Minimum

      D-48/50 D-0.5/23

      Kv

      ≥40

      43

      6. Flexural strength ,Minimum

       

      Mpa

       

       

      Length direction

      A

      ≥415

      580

      Cross direction

      A

      ≥345

      460

      7.Arc resistance ,Minimum

      D-48/50
      D-0.5/23

      S

      ≥60

      160

      8.Flammability

      A

      S

      UL-94V0

      UL-94V0

      9. Permittivity 1MHZ ,Maximum

      A

       

      ≤5.4

      4.8

      10.Loss tangent 1MHZ ,Maximum

      A

      ---

      ≤0.035

      0.011

      11.Thermal stress 288℃,10sec( Minimum )                    

       

      ---

       

       

      Non etched specimen

      A

      NO DEFECT

      NO DEFECT

      Etched

      A

      NO DEFECT

      NO DEFECT

      12. TG(DSC,℃)

      A

      ≥150

      152

      13.CTE(Z-axis)

      Before Tg

      PPM/℃

      ≤60

      45

      After Tg

      PPM/℃

      ≤300

      240

      50-260℃

      %

      ≤3.5

      2.9

      14.T260

      TMA

      min

      ≥30

      60

      Note:
      the treatment of letters and numerical meaning
          A - plate delivery stage
          D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                                     Warpage of                                                                               Warpage of

                                    (No-treating)                                                                               (After treating:125℃ 2hr)

                      

                               Peel strength

                

        ※Specimen T hickness:1.6mm single side board

      PURCHASING INFORMATION    

      Thickness

      Copper foil

      Standard Size

      0.2mm  to  3.4mm

      12μm  to    105μm

      1041×1245mm(41″×49″)    940×1245mm(37″×49″)
      1092×1245mm(43″×49″)    

      ※ Other sheet size and thickness could be available upon request.

       

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