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      RL150&CTI600

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      产品描述

      RL150&CTI600

       

       

      (UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking/ Excellent resistance to tracking CTI> 600V

       

      特点            

      1. Tg ≥150℃无铅兼容FR-4板材&优秀的耐漏电起痕性CTI>600V
      2. UV Blocking/AOI兼容
      3. 优良的机械加工性能
      4. 优秀的耐CAF性能

      应用领域            
      电脑、仪器仪表、摄像机、通讯设备、
      电子游戏机、汽车等

       

       FEATURES     

      1. Tg ≥ 150 ℃ lead-free compatible FR-4 board& Excellent resistance to tracking CTI> 600V
      2. UV Blocking/AOI Compatible
      3. Excellent machinability processability 
      4. Excellent Anti-CAF Performance

       APPLICATIONS     
      Computer,lnstrumentation,VCR,communication equipment,electronic game machine,automotive electronics,and etc。

       

      GENERAL PROPERTIES    

      Test Item

      Test condition

      Units

      Standard value

      Typical value

      1.Peel Strength , IBS/IN,Minimum,1 OZ

       

      IBS/IN

       

       

      As received

      A

      ≥8.0

      12.6

      After thermal stress

      A

      ≥8.0

      12.6

      2. Volume resistivity ,Minimum
      At elevated temperature E-24/125

      E-24/125

      MΩ.cm  

      ≥103

      ≥106

      3. Surface resistivity , Minimum                              
      At elevated temperature E-24/125        

       E-24/125

      ≥103

      ≥106

      4.Water absorption , Maximum

      E-1/105+des

      %

      ≤0.50

      0.13

      5.Dielectric Breakdown, Minimum

      D-48/50 D-0.5/23

      Kv

      ≥40

      43

      6. Flexural strength ,Minimum

       

      Mpa

       

       

      Length direction

      A

      ≥415

      520

      Cross direction

      A

      ≥345

      450

      7.Arc resistance ,Minimum

      D-48/50
      D-0.5/23

      S

      ≥60

      140

      8.Flammability

      A

      S

      UL-94V0

      UL-94V0

      9. Permittivity 1MHZ ,Maximum

      A

       

      ≤5.4

      4.9

      10.Loss tangent 1MHZ ,Maximum

      A

      ---

      ≤0.035

      0.016

      11.Thermal stress 288℃,10sec( Minimum )                    

       

      ---

       

       

      Non etched specimen

      A

      NO DEFECT

      NO DEFECT

      Etched

      A

      NO DEFECT

      NO DEFECT

      12. TG(DSC,℃)

      A

      ≥150

      152

      13. CTI,V

      TEC-112

      V

      ≥600

      600

      Note:
      the treatment of letters and numerical meaning
          A - plate delivery stage
          D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                            Warpage of                                                                                Warpage of

                            (No-treating)                                                                               (After treating:125℃ 2hr)

                                                 

                             Peel strength

                                

        ※Specimen T hickness:1.6mm single side board

      PURCHASING INFORMATION    

       

      Thickness

      Copper foil

      Standard Size

      0.2mm  to  3.4mm

      12μm  to    105μm

      1041×1245mm(41″×49″)    940×1245mm(37″×49″)
      1092×1245mm(43″×49″)   

      ※ Other sheet size and thickness could be available upon request.

       

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